TY  - BOOK
AU  - Lau, John H
AU  - Aibin, Yu
TI  - Advanced MEMS packaging
SN  - 9780071626231
U1  - 621.381046 LAU 
PY  - 2010///
CY  - New York
PB  - McGraw Hill
KW  - Microelectromechanical systems
ER  -