Lau, John H <br/><br/>
Advanced MEMS packaging 

 - New York:  McGraw Hill,  2010 
 - xxiii, 552 p. : ill. ; 24 cm 
<br/><br/><label>ISBN: </label>9780071626231 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems
<br/><br/><label>Dewey Class. No.: </label>621.381046 LAU